SIA461DJ-T1-GE3【PDF 1/9 页】MOSFET P-CH 20V 12A SC706L

收藏本站

您好，
买卖IC网欢迎您。
请登录
免费注册

买卖IC网

Sheet目录514

[1页]2页 3页 4页 5页

New Product

SiA461DJ

Vishay Siliconix

P-Channel 20-V (D-S) MOSFET

FEATURES

PRODUCT SUMMARY

? TrenchFET ? Power MOSFET

V DS (V)

- 20

R DS(on) ( ? ) Max.

0.033 at V GS = - 4.5 V

0.042 at V GS = - 2.5 V

0.055 at V GS = - 1.8 V

I D (A) a

- 12

Q g (Typ.)

18 nC

? Thermally Enhanced PowerPAK ? SC-70 Package

- Small Footprint Area

- Low On-Resistance

? Material categorization:

For definitions of compliance please see

www.vishay.com/doc?99912

APPLICATIONS

PowerPAK SC-70-6L-Sin g le

? Smart Phones, Tablet PCs, Mobile Computing

- Battery Switch

- Charger Switch

- Load Switch

(4) S

Markin g Code

Part # code

B V X

(3) G

2.05 mm

XXXX

Lot Tracea b ility

and Date code

(1, 2, 5, 6) D

Orderin g Information:

SiA461DJ-T1-GE3 (Lead (P b )-free and Halogen free)

ABSOLUTE MAXIMUM RATINGS (T A = 25 °C, unless otherwise noted)

P-Channel MOSFET

Parameter

Drain-Source Voltage

Gate-Source Voltage

T C = 25 °C

Symbol

V DS

V GS

Limit

- 20

±8

- 12 a

Unit

Continuous Drain Current (T J = 150 °C)

Pulsed Drain Current (t = 300 μs)

Continuous Source-Drain Diode Current

T C = 70 °C

T A = 25 °C

T A = 70 °C

T C = 25 °C

T A = 25 °C

T C = 25 °C

I D

I DM

I S

- 12 a

- 8.3 b, c

- 6.6 b, c

- 20

- 12 a

- 2.8 b, c

17.9

Maximum Power Dissipation

T C = 70 °C

T A = 25 °C

P D

11.4

3.4 b, c

T A = 70 °C

2.2 b, c

Operating Junction and Storage Temperature Range

Soldering Recommendations (Peak Temperature) d, e

T J , T stg

- 55 to 150

260

°C

THERMAL RESISTANCE RATINGS

Parameter

Symbol Typical Maximum Unit

Maximum Junction-to-Ambient b, f

Maximum Junction-to-Case (Drain)

t ? 5s

Steady State

R thJA

R thJC

29 37

5.5 7

°C/W

Notes:

a. Package limited.

b. Surface mounted on 1" x 1" FR4 board.

c. t = 5 s.

d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed copper

(not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not

required to ensure adequate bottom side solder interconnection.

e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.

f. Maximum under steady state conditions is 80 °C/W.

Document Number: 63838

S12-0539-Rev. A, 12-Mar-12

For more information please contact: pmostechsupport@vishay.com

www.vishay.com

This document is subject to change without notice.

THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000

发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

*型号	*数量	厂商	批号	封装

添加更多采购

采购需求

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

我的联系方式